Introduction

Product's type: Single-sided/double-sided, gold-plated/HAL finish and flux.
Base Material: FR4 ,CEM-1, CEM-3, TEFLON
Base Material: Thickness: 0.4~3.0mm
Copper Foil Thickness:1 OZ, 2 OZ, 3 OZ, 4 OZ, 0.33 OZ
Maximum-product Board: 510 x 700mm
Minimum Drilling Hole Size: 0.3mm
Minimum Line/Spacing: Gold-plated 3um, HAL 0.12um
Flash Gold Plating: above or equal to 0.05um
Average Hole Wall Copper Thickness For HAL Board: above or equal to 25um
Gold-finger Plating: above or equal to 0.1um
Solder Mask Ink: Themic Solidify ink, Liquid Sensitization Ink, UV ink.
Outline: Punch, Routing, V-CUT, Reveling, Bevel
Tolerance:  Outline Tolerance:  +/-0.10mm    Hole Diameter Tolerance: +/-0.075
          Hole Location Tolerance:  +/-0.10mm      V-CUT Tolerance:+/- 0.10mm
Warp: According to the IPC-600E Standard
Monthly Output: Double-sided 10,000m2
Delivery Time: For old order: 7-10 working days
            For new order: 10-15 working days
Sampling available / lead time: Double-sided: 7-10 working days